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Process

Control Item Control Standard Ca Cp Cpk
Inner Layer Etching Trace Width&Spacing ±20% ≤|0.25| ≥1.0 ≥1.33
Lamination Lamination Board Thickness ±5% ≤|0.25| ≥1.0 ≥1.33
Dielectric Thickness ±1.4mil ≤|0.25| ≥1.0 ≥1.33
Drilling Hole Diameter ±3mil ≤|0.25| ≥1.0 ≥1.33

Hole Position

±3mil

≤|0.25|

≥1.0 ≥1.33
Drilling Nailhead ≤75% ≤|0.25| ≥1.0 ≥1.33
Drilling Roughness ≤1000U" ≤|0.25| ≥1.0 ≥1.33
Panel Plating Flash Copper Thickness ≥150U" ≤|0.25| ≥1.0 ≥1.33
Black Light ≥8Class ≤|0.25| ≥1.0 ≥1.33
Outer Layer Trace Trace Width&Spacing ±20% ≤|0.25| ≥1.0 ≥1.33
Copper Thickness(Trace) 2400±600U" ≤|0.25| ≥1.0 ≥1.33
Pattern Plating Copper Thickness(Hole) 1400±600U" ≤|0.25| ≥1.0 ≥1.33
Plating Roughness ≤1000U" ≤|0.25| ≥1.0 ≥1.33
Nikel / Au Plating Thickness(Ni) ≥100U" ≤|0.25| ≥1.0 ≥1.33
Thickness(Au) 1-3U" ≤|0.25| ≥1.0 ≥1.33
H.A.S.L. Tin-Lead Thickness 800±600U" ≤|0.25| ≥1.0 ≥1.33
Routing CNC Outline Dimension ±0.15mm ≤|0.25| ≥1.0 ≥1.33
Punching Outling Dimension ±0.1mm ≤|0.25| ≥1.0 ≥1.33
FQA Warp&Twist ≤0.75% ≤|0.25| ≥1.0 ≥1.33
Solderability ≤500DPPM ≤|0.25| ≥1.0 ≥1.33
Trace Width&Spacing ±20% ≤|0.25| ≥1.0 ≥1.33
Finished Board Thickness ±8% ≤|0.25| ≥1.0 ≥1.33
 
 
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