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Positioning

 

  + / - mm +/- inches
1. Hole or center position tolerance   0.050 0.002
2. Pattern registration with outline   0.076 0.003
3. Punching shift with outline   0.150 0.006
4. Min. clearance between Holes and outline   Equal to Board Thicknes
Hole size Tolerance
1. Smallest metallised Hole size 0.250 0.010   0.250 0.010
2. Maximum drill size   6.500 0.256
3. Maximum Aspect Ratio 6      
4. Hole size tolerance (PTH) 0.075 0.003
  (NPTH) 0.050 0.002
5. Drill hole to drill hole pitch tolerance (t < 0.6 mm)   0.075 0.003
Outline Tolerance
1. Punched Outline Dimension   0.150 0.006
2. Routed outline Dimension   0.100 0.004
Plating Tolerance
1. Minimum PTH thickness   3 uM 120 microinch
2. Minimum Gold thickness   0.05 uM 2 microinch
3. Minimum Nickel thickness   3 uM 120 microinch
4. Max. Cu thk.   28 uM 1 mil or above
5. Max. Ni thk.   10 uM 400 microinch
6. Max. Au thk.   1.25 uM 50 microinch
7. Hot Air solder Levelling   2 - 38 u M  

Solder Mask

1. Minimum Opening   0.075 0.003
2. Minimum trace   0.100 0.004
3. Min. trace between pads   0.100 0.004
4. Registration tolerance   0.080 0.003
5. Mask thickness on bare base material 0.7 to 1.2 mil
  pads 0.6 to 1.0 mil
  traces 0.2 to 0.5 mil
V - Cutting (scoring)
Board shape must have at least 2 parallel lines for V-score !      
1. Min. remaining thickness for FR4 0.3+/-0.1  
  for CEM3 or CEM 1 0.5+/-0.1  
2. Location tolerance   +/-0.2  
3. Maximum board size for V-cut   387 15.25"
4. Min. board size for V-cut   100 4.00"
5. Min. thk. requirement for V-cut   0.6 mm  
6. Angle available to choose   30 and 45  
7. V-cut to outline tolerance   +/- 0.15  
CHAMFERING
1. Tolerance   +/-0.15mm  
2. Angles in bevelling   45 & 60  
ANGULAR TOLERANCE
For board thk. = or < 0.6mm's outline   +/- 0.5  
Outer/Inner Layers
1. Min. annualar ring   0.01 0.0004
2. Min. line width   0.10 0.0040
3. Min. line spacing   0.10 0.0040
4. Registration tolerance   +/-0.075 +/-.003
5. Min. Finish Board Thickness D/S 0.20 0.008
  4/L 0.40 0.016
  6/L 0.80 0.031
6. Maximum Finish Copper Thickness 6 oz 210 micron 0.0084
Panel Size
Maximum Panel Size 18 " X 24"    
Maximum Circuit Size 17" X 22"    

Flexible & Ridid Flexible single side to 4 layers

Maximum Working Size

500 * 600mm
Surface Finish

Tin-Lead Plating, Chemical Tin, Gold Plating, Ni/Au

Technical Capability Minimun track/gap: 3mil
  Minimum finish holes: 0.2mm
Material Polymide or Polyester
  PCB thickness:  0.012, 0.015, 0.025, 0.05mm
  Copper thickness: 0.011, 0.018, 0.035, 0.070, 0.100mm

Technology Roadmap

 

Existing 2005 2006
Hole Location Tolerance 0.075mm 0.075mm 0.075mm
Min. outer line spacing 0.1mm 0.075mm 0.075mm
Min. inner line spacing 0.075mm 0.050mm 0.050mm
Min. soldermask opening 0.075mm 0.050mm 0.050mm
Type of surface finish

HAL, OSP,
ENIG,
carbon ink,
peelable S/M,
immersion tin

HAL, OSP,
ENIG,
carbon ink,
peelable S/M,
immersion tin

HAL, OSP,
ENIG,
carbon ink,
peelable S/M,
immersion tin/siliver

Impedance control +/- 10% +/- 8% +/- 8%
Warpage 0.7% 0.5% 0.5%
Blind/Buried via board No Yes Yes
Layer count 8-10/L 10-12/L 12-14/L
HDI board No Sample Production
 
 
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